Fraunhofer Institut für Zuverlässigkeit und Mikrointegration IZM

Endorse Company
Company Profile Electronic Packaging for Microsystems Medical applications, in particular, benefit from advanced assembly and packaging technologies, which maximize the functional density and reliability of mesa-, micro- and nanosystems. Such technologies have so far been successfully applied to products like pacemakers, hearing aids, bio-microfluidic devices like lab-on-chip platforms or retinal implants and sucessively find their way to medical use in apparel and everyday objects. By using telemedicine infrastructure combined with advanced sensor technology and non-obtrusive system integration for constant monitoring at the point-of-care (POC), overall medical costs are reduced while quality of care is improved. Fraunhofer IZM acts as a one-stop-shop solution provider for customers from research and industry in search for miniaturized integration of microelectronic, microsensory, microfluidic and micro-optical systems.